Thermal Management

Created to perform when the heat is on

• Silicone & Non-Silicone Thermal Pastes
• Phase Change Materials
• Silicone & Non-Silicone Gap Pads

• RTVs and Bonding Products
• Encapsulation Resins
• 0.9 to 5.5W/m.K

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Electrolube’s extensive Thermal Interface Material (TIM) Range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.