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Thermal Management
Created to perform when the heat is on
- Non-Silicone Pastes
- Silicone Pastes
- RTVs and Bonding Products
- Encapsulation Resins
- 0.9 to 3.4W/m.K
During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.
More info > Download product selector chart > Download product brochure >Obsolete Thermal Management Products
The following products have been discontinued and superseded with the listed replacement. While the replacement product will exhibit improved characteristics, we would always advise further testing to ensure the product is suitable for your application.
| Product | Obsolete Codes | Superseded by: |
|---|---|---|
| TCR | TCR75S | TCOR75S |
| TCORP | TCORP | Contact Us |
| HTS | HTS30SL | HTS |