Electronics Control Unit (ECU)

Electrolube Conformal Coatings, Potting Compounds, Thermal management solutions and other associated product solutions for all areas of the Automotive Electronics industry.
  • Corrosive Gas Protection
  • Thermal Cycling Resistance
  • Salt Mist Protection
  • Moisture Protection
  • Dust + Environment Protection

The Electronics Control Units are some of the most important parts of a modern vehicle, controlling the majority of the electronics systems on board and connecting with the central / cabin controls. It is important then that the PCB and components of the ECU, which is often exposed to extreme temperature shifts, corrosive gases and other harsh conditions is reliable and protected from corrosion. Electrolube products are created to thrive in such conditions, protecting the PCB and components and ensuring reliability. Electrolube products such as the 2K range have been especially developed for the Automotive industry and offer superb levels of protection.

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Electrolube have an extensive range of products suitable for all automotive application environments, we have collated a selection of products in a specialist brochure to aid your selection which can be viewed here:

Electrolube also have a number of articles and blogs which you may find useful in selecting the right material for your application

Read more about specific products for the Automotive market:

Articles

Blogs

Automotive Electronics

Electronics Control Unit (ECU)

HTSP - Silicone Heat Transfer Compound Plus

HTSP
Silicone Heat Transfer Compound Plus

35ml - 50ml - 100ml - 830ml - 1Kg - 10Kg - 25Kg

Product code: EHTSP35SL- EHTSP50T - EHTSP100T- EHTSP830G- EHTSP01K- EHTSP10K - EHTSP25K


HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.


Key Properties:
  • Superior thermal conductivity even at high temperatures 3.0 W/m.K
  • Excellent non-creep characteristics
  • Wide operating temperature range -50°C to +200°C
  • Low evaporation weight loss

Product data sheets
HTSP (tds) Download

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