Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.
More info > Download product selector chart > Download product brochure >Product code: ER1426RP250G - ER1426K5K
A two part epoxy resin designed for powder bonding and impregnation applications. Its a very low viscosity resin system ideal for use on complicated geometries or around components placed close together, while its long useable life makes it ideal for impregnation.
Its excellent clarity allows for visual inspection of the electronics and components through the resin while its high tensile strength provides good mechanical and physical protection.
ER1426 (tds) | Download |
044-ER1426A-SDS10884 (msds) | Download |
044-ER1426B-SDS10885 (msds) | Download |