Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.
More info > Download product selector chart > Download product brochure >Product code: ER2183RP250G - ER2183RP500G - ER2183K1K - ER2183K5K - ER2183K25K
ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.
It is a low viscosity system ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a wide operating temperature range and can be used in a variety of potting and encapsulation applications.
ER2183 (tds) | Download |
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