Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.
More info > Download product selector chart > Download product brochure >Product code: ER2225RP250G - ER2225K5K
ER2225 a black epoxy potting compound formulated to meet the exacting requirements of the automotive industry, although will find application in a wide range of industries where high temperature and chemical resistance are called for. Designed as a potting compound for electronic units, or to encapsulate components such as sensors, ER2225 has excellent chemical resistance to a wide range of chemicals and fluids. It also offers a wide continuous temperature operating range (-40 to +180°C), with the ability of going up to 210°C for short excursions, and shows good thermal conductivity (1.1W/m.K), offering superb combined protection of electronic components and electrical devices. However due to its versatility it can be used in a variety of other electronics applications where protection against thermal cycling is required. Although ER2225 does contain fillers, it shows good flow around components in a unit.
ER2225 (tds) | Download |
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