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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER2225 - High Temperature Resistant Epoxy

ER2225
High Temperature Resistant Epoxy

250g - 5kg

Product code: ER2225RP250G - ER2225K5K

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ER2225 a black epoxy potting compound formulated to meet the exacting requirements of the automotive industry, although will find application in a wide range of industries where high temperature and chemical resistance are called for. Designed as a potting compound for electronic units, or to encapsulate components such as sensors, ER2225 has excellent chemical resistance to a wide range of chemicals and fluids. It also offers a wide continuous temperature operating range (-40 to +180°C), with the ability of going up to 210°C for short excursions, and shows good thermal conductivity (1.1W/m.K), offering superb combined protection of electronic components and electrical devices. However due to its versatility it can be used in a variety of other electronics applications where protection against thermal cycling is required. Although ER2225 does contain fillers, it shows good flow around components in a unit.

Key Properties:
  • High chemical resistance
  • Wide operating temperature range
  • Excellent high temperature resistance up to 210°C
  • Good thermal conductivity
  • Good processability
  • RoHS Compliant
Product data sheets
ER2225 (tds) Download

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