Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Product code: PE7501RP250G
This two-part clear amber Polyester resin uses an innovative blend of technologies to provide the same performance as polyurethane resins whilst removing the hazardous isocyanates used to cure them.
It is a soft, flexible resin which can easily be dug-out in order to remove the cured compound from encapsulated units in order to perform repair work or replace components. Whilst this resin can be easily dug out if required, it will maintain an excellent level of hardness stability over a wide operating temperature range meaning that this does not limit its use.
The resin exhibits a low sensitivity to moisture, both during and after cure and maintains an excellent electrical properties.
This potting or encapsulation compound is a good choice for units which may need to be reworked or repaired at some stage in their working life, while maintaining good characteristics for a range of possible applications.
For Full product specs please see the TDS link below.