Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Product code: UR5041RP250G - UR5041K1K - UR5041K5K - UR5041K25K
UR5041 is a two-part black encapsulation and potting compound formulated to perform to the highest levels.
Its high toughness and resistance to tearing mean that it offers excellent physical protection to the encapsulated electronics, while it has good adhesion to most substrates.
This resin system provides exceptional resistance to sea water, as well as temperature extremes of -60°C upto 125°C making it the ideal choice for marine applications such as sensor encapsulation.
For Full product specs please see the TDS link below.