Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.
More info > Download product selector chart > Download product brochure >Product code: UR5048RP250G - UR5048K1K - UR5048K5K
This flexible encapsulation compound is clear amber in colour with low viscosity and low shore hardness. It has good digoutable properties making it a choice for potting units that may require rework or repair. In most cases because of the transparency of the cured compound, the potted electronics can be easily inspected and the defect spotted. The resin can then be easily dug out in order to make the repair, without having to strip down the entire unit.
It also absorbs very little water making it an ideal choice for electronics operating in humid environments.
For Full product specs please see the TDS link below.
UR5048 (tds) | Download |
044-UR5048A-SDS568 (msds) | Download |
044-UR5048B-SDS571 (msds) | Download |