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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.

UL approved
Potting / encapsulating
Sealing and protection

Cable jointing
Coloured and optically clear
Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins

Polyurethane

UR5048 - Clear Amber Polyurethane Resin

UR5048
Clear Amber Polyurethane Resin

250g - 1KG - 5KG

Product code: UR5048RP250G - UR5048K1K - UR5048K5K

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This flexible encapsulation compound is clear amber in colour with low viscosity and low shore hardness. It has good digoutable properties making it a choice for potting units that may require rework or repair. In most cases because of the transparency of the cured compound, the potted electronics can be easily inspected and the defect spotted. The resin can then be easily dug out in order to make the repair, without having to strip down the entire unit.

It also absorbs very little water making it an ideal choice for electronics operating in humid environments.

For Full product specs please see the TDS link below.

Key Properties:

very low hardness - can be cut or dug out for easy removal
Transparent / clear to allow fast fault finding
Low embedment stress
Ideal for protecting delicate components from mechanical and thermal shock
Excellent low temperature performance; remains flexible to -60°C
Very low water absorption; ideal for high humidity environments
RoHS-2 Compliant

Product data sheets

UR5048 (tds)

Log into our MSDS database for Safety Data Sheets: MSDS