Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Polyurethane

UR7002 - Yellow Polyurethane Resin

UR7002
Yellow Polyurethane Resin

250g - 150kg

Product code: UR7002K150K

This Product Has been Superseded with: Contact Us

The following product has been discontinued and superseded with the listed replacement. While the replacement product will exhibit improved characteristics, we would always advise further testing to ensure the product is suitable for your application. '


UR7002 is a two-part potting and encapsulation compound formulated for high performance. It exhibits a high degree of flexibility, ideal for encapsulating delicate electronics or components which it maintains throughout a very wide operating temperature range.

UR7002 also offers excellent water resistance, and high moisture resistance before and after fully cured. The cured resin is tear and impact resistant, providing excellent all-round protection it is ideally suited to challenging environments such as under-bonnet automotive electronics.

UR7002 contains minimal isocyanate content in the non-reacted system which ensures a significantly reduced hazard in terms of operator safety.


Key Properties:
  • Excellent low temperature performance
  • Excellent tear strength and impact strength
  • Flexibility at temperature extremes
  • ideal for applications with varying temperature
  • Low moisture sensitivity during and after cure;
  • Excellent resistance to water
  • RoHS Compliant

Product data sheets
UR7002 (tds) Download

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