Thermally Conductive Potting Compounds

Created to perform when the heat is on

Thermally Conductive Potting Compounds
  • Epoxies
  • Polyurethanes
  • Silicones
  • Two-Part systems
  • Encapsulation of components
  • Potting complete units

Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been designed for this specific purpose.

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Thermally conductive resins can be used to pot a PCB unit, or encapsulate electronic components in order to transfer heat away, either to the housing or the resin itself acting as a simple heatsink. Potting a PCB with thermally conductive resin will allow the material to flow into spaces around components which would otherwise not be suitable for thermal interface materials, and can be an efficient way to manage thermal transfer over a whole unit.

The added benefit to using a thermally conductive potting compound is that it also provides additional protection to the PCB. The additional properties will vary depending on the resin chemistry selected, and application requirements but usually include some or all of the following examples; damage /shock resistance, water resistance, chemical and gas resistance as well as offering some structural support.

A good example of where the use of a thermally conductive resin can benefit over a standard thermal interface material is in an LED unit where even small increases in temperature can affect the colour, life expectancy and performance of the LED. By potting with a thermally conductive resin we can easily manage this temperature, while also offering additional properties to protect the LED PCB from corrosive elements such as rain water.

We would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Thermally Conductive Potting Compounds

ER2220  - Thermally Conductive Epoxy

ER2220
Thermally Conductive Epoxy

250g Resin Pack - 5Kg

Product code: ER2220RP250G - ER2220K5K


ER2220 is a flame retardant, thermally conductive, two part encapsulation compound based on epoxy technology. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional thermally conductive encapsulants. Combined with flame retardance achieving UL94 V-0 level, ER2220 provides the ultimate in protection and performance for avast array of applications, including those in the rapidly expanding LED industry.


Key Properties:
  • Very high thermal conductivity: 1.54 W/m.K
  • Flame Retardant
  • Utilises non-abrasive fillers
  • Used for encapsulating PCBs or devices requiring effective thermal dissipation
  • Provides environmental protection
  • Wide operating temperature range: -40°C to +130°C

Product data sheets
ER2220 (tds) Download

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