Thermal Management Products for LEDs

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit.
  • Thermal Pastes
  • Phase Change Material
  • Gap Pads
  • Thermal Bonding
  • RTVs
  • Encapsulation Resins

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).

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With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.

Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.

If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.

If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:

LED Industry

Thermal Management of LEDs

ER2183 - Black Epoxy Resin

ER2183
Black Epoxy Resin

250g and 500g resin pack, 1KG, 5KG, 25KG kits

Product code: ER2183RP250G - ER2183RP500G - ER2183K1K - ER2183K5K - ER2183K25K


ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.

It is a low viscosity system ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a wide operating temperature range and can be used in a variety of potting and encapsulation applications.


Key Properties:
  • Thermally Conductive Epoxy
  • Low viscosity alternative to ER2220: 5000mPa s
  • High thermal conductivity; 1.10W/m.K
  • Easy to mix, uses non-abrasive fillers
  • Wide operating temperature (-40°C to 130°C)
  • Meets UL94
  • RoHS Compliant


Product data sheets
ER2183 (tds) Download

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