Thermal Management Products for LEDs

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit.
  • Thermal Pastes
  • Phase Change Material
  • Gap Pads
  • Thermal Bonding
  • RTVs
  • Encapsulation Resins

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).

More info >

With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.

Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.

If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.

If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:

LED Industry

Thermal Management of LEDs

HTCP  - Non-Silicone Heat Transfer Compound Plus

HTCP
Non-Silicone Heat Transfer Compound Plus

2ml - 20ml - 100ml - 700g - 1k - 25kg

Product code: HTCP02S - HTCP20S - HTCP100T - HTCP700G - HTCP01K - HTCP25K


HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.


Key Properties:
  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity

Product data sheets
HTCP (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS