Thermal Management Products for LEDs

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit.
  • Thermal Pastes
  • Phase Change Material
  • Gap Pads
  • Thermal Bonding
  • RTVs
  • Encapsulation Resins

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).

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With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.

Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.

If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.

If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:

LED Industry

Thermal Management of LEDs

HTSX - Silicone Heat Transfer Compound Xtra

HTSX
Silicone Heat Transfer Compound Xtra

35ml - 830g

Product code: HTSX35SL - HTSX830G


HTSX is a silicone thermal interface material (TIM) which has been developed to perform in more extreme conditions than its sister product HTS. It exhibits extended characteristics to HTS, with higher thermal conductivity, extended operating temperatures and excellent stability with a much-reduced oil bleed.

It is a non-curing thermal paste, making it easy to apply and easy to rework if necessary. It is ideal for use on heatsinks or between components to dissipate heat away from the electronic device and can be used in a wide range of industry applications.

As with any thermal interface material, we would recommend testing before selecting as the TDS figures and performance of the product may vary depending on the individual application. If you have any questions, or require any assistance with selecting the right material, please free to contact our technical support team.


Key Properties:
  • General purpose silicone thermal paste;
  • Reduced oil-bleed
  • Non-curing thermal paste
  • Excellent stability in a range of conditions
  • Exceptionally wide operating temperature range
  • Excellent thermal conductivity;
  • Allows simple and efficient rework of components if required
  • RoHS Compliant

Product data sheets
HTSX (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS