Thermal Management Products for LEDs

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit.
  • Thermal Pastes
  • Phase Change Material
  • Gap Pads
  • Thermal Bonding
  • RTVs
  • Encapsulation Resins

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).

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With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.

Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.

If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.

If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:

LED Industry

Thermal Management of LEDs

TBS  - Thermal Bonding System

TBS
Thermal Bonding System

20ml syringe - 1Kg

Product code: TBS20S - TBS01K


Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where 'piggy back' arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.


Key Properties:
  • Two part epoxy bonding system
  • Very high bond strength
  • High thermal conductivity: 1.10 W/m.K
  • Eliminates need for mechanical fixing by providing a permanent bond
  • Wide operating temperature range: -40°C to +120°C
  • Includes glass beads for a set thickness to be applied

Product data sheets
TBS (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS