Thermal Management Solutions

Created to perform when the heat is on

Electrolube thermal management products and a PCB
  • Silicone & Non-Silicone Thermal Pastes
  • Phase Change Materials
  • Silicone & Non-Silicone Gap Pads
  • RTVs and Bonding Products
  • Encapsulation Resins
  • 0.9 to 5.5W/m.K

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Electrolube’s extensive Thermal Interface Material (TIM) Range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

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Newton’s law of cooling states that the rate of loss of heat is proportional to the temperature difference between the body and its surroundings. Therefore, as the temperature of the component increases and reaches its equilibrium temperature, the rate of heat loss per second will equate to the heat produced per second within the component. This temperature may be high enough to significantly shorten the life of the component or even cause the device to fail. It is in such cases that thermal management measures need to be taken. The same considerations can be applied to a complete circuit or device which incorporates heat producing individual components.

Heat is lost from a component to its surroundings at the surface of the component. The rate of loss of heat will increase with the surface area of the component; a small device producing 10 watts will reach a higher temperature than a similar powered device with a larger surface area.

This is where heat sinks are used – varying in size and shape, heat sinks can be designed to offer a significantly increased surface area to maximise heat dissipation. They are typically connected to components which generate a large amount of thermal energy when used and therefore dissipate such energy away from the device to avoid failure due to over-heating.

Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.

Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces. The use of a thermal interface material between such gaps ensures complete contact between the two surfaces and in turn more efficient heat conductance.

The ongoing trend for product miniaturisation – coupled with more modern, higher powered devices – has ensured that efficient thermal management is an essential part of both modern and future electronics design, the LED lighting market being just one example. Thermal management products are also offering solutions for greater efficiency in green energy development; photovoltaic inverters – which are known to be particularly sensitive to temperature; connections between the heat-pipe and water storage tank for solar-heating applications; hydrogen fuel cells; wind power generators, are just a few examples.

Thermal Management Solutions

Resins

ER2221 - Thermally Conductive Epoxy

ER2221
Thermally Conductive Epoxy

250g - 5 KG

Product code: ER2221RP250G - ER2221K5K


ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black, while ER2222 is a red version, otherwise the cured resins do not differ in their physical properties. Both exhibit excellent thermal resistance up to an operating temperature of 150°C and have an enhanced thermal conductivity value in comparison to other encapsulants of 1.20W/m.K.

Both resin systems are filled, but the viscosity of the mixed system is low in comparison to other resins with a similar filler loading. This allows the mixed resin to be easily mixed and can flow between components and devices with limited spacing.

ER2221 is an excellent choice for encapsulating an electronic device which requires high levels of thermal resistance and protection such as automotive, aerospace, industrial or other applications which are subject to harsh environments.


Key Properties:
  • Two component black epoxy resin
  • Excellent high temperature resistance up to 150°C
  • Enhanced thermal conductivity
  • Low viscosity for a filled system;
  • Does not contain abrasive fillers; low wear on dispensing machinery
  • UL94 V-0 Approval
  • RoHS Compliant


Product data sheets
ER2221 (tds) Download

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