Thermal Management Solutions

Created to perform when the heat is on

Electrolube thermal management products and a PCB
  • Silicone & Non-Silicone Thermal Pastes
  • Phase Change Materials
  • Silicone & Non-Silicone Gap Pads
  • RTVs and Bonding Products
  • Encapsulation Resins
  • 0.9 to 5.5W/m.K

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Electrolube’s extensive Thermal Interface Material (TIM) Range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

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Newton’s law of cooling states that the rate of loss of heat is proportional to the temperature difference between the body and its surroundings. Therefore, as the temperature of the component increases and reaches its equilibrium temperature, the rate of heat loss per second will equate to the heat produced per second within the component. This temperature may be high enough to significantly shorten the life of the component or even cause the device to fail. It is in such cases that thermal management measures need to be taken. The same considerations can be applied to a complete circuit or device which incorporates heat producing individual components.

Heat is lost from a component to its surroundings at the surface of the component. The rate of loss of heat will increase with the surface area of the component; a small device producing 10 watts will reach a higher temperature than a similar powered device with a larger surface area.

This is where heat sinks are used – varying in size and shape, heat sinks can be designed to offer a significantly increased surface area to maximise heat dissipation. They are typically connected to components which generate a large amount of thermal energy when used and therefore dissipate such energy away from the device to avoid failure due to over-heating.

Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.

Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces. The use of a thermal interface material between such gaps ensures complete contact between the two surfaces and in turn more efficient heat conductance.

The ongoing trend for product miniaturisation – coupled with more modern, higher powered devices – has ensured that efficient thermal management is an essential part of both modern and future electronics design, the LED lighting market being just one example. Thermal management products are also offering solutions for greater efficiency in green energy development; photovoltaic inverters – which are known to be particularly sensitive to temperature; connections between the heat-pipe and water storage tank for solar-heating applications; hydrogen fuel cells; wind power generators, are just a few examples.

Thermal Management Solutions

Silicone Pastes

HTSX - Silicone Heat Transfer Compound Xtra

HTSX
Silicone Heat Transfer Compound Xtra

35ml - 830g

Product code: HTSX35SL - HTSX830G


HTSX is a silicone thermal interface material (TIM) which has been developed to perform in more extreme conditions than its sister product HTS. It exhibits extended characteristics to HTS, with higher thermal conductivity, extended operating temperatures and excellent stability with a much-reduced oil bleed.

It is a non-curing thermal paste, making it easy to apply and easy to rework if necessary. It is ideal for use on heatsinks or between components to dissipate heat away from the electronic device and can be used in a wide range of industry applications.

As with any thermal interface material, we would recommend testing before selecting as the TDS figures and performance of the product may vary depending on the individual application. If you have any questions, or require any assistance with selecting the right material, please free to contact our technical support team.


Key Properties:
  • General purpose silicone thermal paste;
  • Reduced oil-bleed
  • Non-curing thermal paste
  • Excellent stability in a range of conditions
  • Exceptionally wide operating temperature range
  • Excellent thermal conductivity;
  • Allows simple and efficient rework of components if required
  • RoHS-2 Compliant

Product data sheets
HTSX (tds) Download