Thermal Management Solutions

Created to perform when the heat is on

Electrolube thermal management products and a PCB
  • Non-Silicone Pastes
  • Silicone Pastes
  • RTVs and Bonding Products
  • Encapsulation Resins
  • 0.9 to 3.4W/m.K

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.

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Newton’s law of cooling states that the rate of loss of heat is proportional to the temperature difference between the body and its surroundings. Therefore, as the temperature of the component increases and reaches its equilibrium temperature, the rate of heat loss per second will equate to the heat produced per second within the component. This temperature may be high enough to significantly shorten the life of the component or even cause the device to fail. It is in such cases that thermal management measures need to be taken. The same considerations can be applied to a complete circuit or device which incorporates heat producing individual components.

Heat is lost from a component to its surroundings at the surface of the component. The rate of loss of heat will increase with the surface area of the component; a small device producing 10 watts will reach a higher temperature than a similar powered device with a larger surface area.

This is where heat sinks are used – varying in size and shape, heat sinks can be designed to offer a significantly increased surface area to maximise heat dissipation. They are typically connected to components which generate a large amount of thermal energy when used and therefore dissipate such energy away from the device to avoid failure due to over-heating.

Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.

Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces. The use of a thermal interface material between such gaps ensures complete contact between the two surfaces and in turn more efficient heat conductance.

The ongoing trend for product miniaturisation – coupled with more modern, higher powered devices – has ensured that efficient thermal management is an essential part of both modern and future electronics design, the LED lighting market being just one example. Thermal management products are also offering solutions for greater efficiency in green energy development; photovoltaic inverters – which are known to be particularly sensitive to temperature; connections between the heat-pipe and water storage tank for solar-heating applications; hydrogen fuel cells; wind power generators, are just a few examples.

Thermal Management Solutions

Bonding Products

TBS  - Thermal Bonding System

TBS
Thermal Bonding System

20ml syringe - 1Kg

Product code: TBS20S - TBS01K


Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where 'piggy back' arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.


Key Properties:
  • Two part epoxy bonding system
  • Very high bond strength
  • High thermal conductivity: 1.10 W/m.K
  • Eliminates need for mechanical fixing by providing a permanent bond
  • Wide operating temperature range: -40°C to +120°C
  • Includes glass beads for a set thickness to be applied

Product data sheets
TBS (tds) Download
044-TBS-A-SDS11154 (msds) Download
044-TBS-B-SDS12670 (msds) Download